![]() |
||||
|
||||
LPC32xx WinCE 6.0 Board Support Package (BSP)Introduction
NXP Semiconductors provides a free Board Support Package (BSP) for the LPC32xx series of microcontrollers running the WinCE 6.0 operating system.
This BSP has been targeted to the Phytec 3250 board which features the NXP LPC3250 MCU.
The BSP supports most for the LPC3250's peripherals as well as some of the Phytec 3250 board interfaces.
This BSP is intended to be used as a reference for developing WinCE 6.0 platform images on the Phytec 3250 board or on a custom board.
This board support package is maintained by NXP Semiconductors and is periodically updated with issue fixes or new features.
Features
The free WinCE 6.0 BSP from NXP Semiconductors supports the following features:
Issues and Limitations
The free WinCE 6.0 BSP from NXP Semiconductors has following issues and limitations:
DocumentationSoftware
The WinCE 6.0 BSP is free to NXP customers for unlimited use with the NXP LPC32xx series of microcontrollers only.
By downloading or using the WinCE 6.0 BSP, you agree to use it solely with these NXP microcontrollers.
Pre-built demonstration images of WinCE 6.0 for the Phytec 3250 board can be evaluated by contacting an NXP FAE.
For customer applications requiring enhanced features or additional support, Adeneo also provides a WinCE 6.0 BSP for the LPC318x and LPC3250 microcontrollers.
More Information
Disclaimer
This software is provided AS-IS by NXP Semiconductors.
NXP Semiconductors does not support or warrant the software contained herein for any purpose other than for informational use.
WinCE 6.0 ResourcesOther Resources |
||||