Typical failure rate curve

Calculation of failure rates and performance levels are determined for a given junction temperature of 55°C as determined from SHTL/DHTL test results. The life predictions reflect an Arrhenius activation energy of 0.7eV at a 60% confidence level.

All data shown is for the 12-month period ending 3rd Quarter, 2004.

Wafer fab processes and packages must be designed so that the wearout period will not start before 100,000 hours at 70°C operational junction temperature. Deviations must be mentioned in the product specification.