NXP advances packaging state-of-the-art with MicroPak (XSON).
Designed for use in portable applications, where board space is always an issue, these packages are dramatically smaller, allowing a smaller, slimmer overall design.
MicroPak packages are 65% smaller than our smallest PicoGate packages.
The MicroPak package can also be used as an alternative to the Wafer-level Chip Scale Package (WCSP), providing more reliable and more rugged performance in the same amount of space because MicroPak devices have 40% larger pad area than those on a WSCP device.
The NXP MicroPak package evolved from the NXP Micro Carrier Device (MCD), a discrete MOS leadless package built using a quad flat nonleaded technology.
MCD is the world's smallest package for single diodes and transistors and improves RF performance by reducing the parasitic capacitances between the die and its package.
This technology is now available in the HC/T and LVC logic families.
Key Features
Incredibly small size enables even smaller system designs
Lead-free for better environmental specifications
Leadless design eliminates problems from bent or non-planar leads
Most devices alternate-sourced for assured supply
Comparison
MicroPak and WCSP Comparison
MicroPak packages are size and footprint compatible with competing WCSP products such as the TI NanoStar™ yet are superior replacements:
Since the same die is used for both the PicoGate and the MicroPak (XSON) logic function, the same electrical performance can be expected
Operating temperature range of -40oC to +125oC (NXP exclusive)
Die encapsulation provides protection from breakage, scratches, humidity, etc.
Encapsulation provides greater package strength and better mechanical system integrity
40% larger solder pads provide greater contact area with circuit board for more reliable connections
Smaller die size results in superior Moisture Sensitivity Level (MSL)
MicroPak is a Drop-In Replacement for WCSP Board Designs
Products
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Single-Gate MicroPak XSON Products
74AUP1G00
1.8V single low-power 2-input NAND gate
74AUP1G02
1.8V single low-power 2-input NOR gate
74AUP1G04
1.8V single low-power inverter
74AUP1GU04
1.8V single low-power unbuffered inverter
74AUP1Z04
1.8V single low-power X-tal driver with enable and internal resistor
74AUP1G06
1.8V single low-power inverter with open-drain output
74AUP1G07
1.8V single low-power buffer with open-drain output