IC packages data handbook

Note: The Philips Semiconductors' IC26 Integrated Circuit Packages Data Handbook is ©2000. It is available by chapter online and in printed format by mail.

Note: The information in the PDF chapters below is ©2000 and may be incomplete or out-dated. These PDF chapters are made available to you for reference only. Please see additional information in our latest package brochure or contact your local sales office for further assistance.

The titles and contents of each chapter are provided below.

• Chapter 1: Overview of IC Packages (97 KB)

• Package Oveview
• Through-Hole Mount Packages (Photograph)
• Surface Mount Packages (Photograph)
• Package Type Overview with Lead Count

• Chapter 2: IC Package Range and Dimensions

• Packages in Ascending Order of Package Name
• Packages in Ascending Order of Philips Outline Code (SOT Number)
• Package Outline Drawings

• Chapter 3: Handling Precautions (74 KB)

• Electrostatic Charges
• Workstation for Handling MOS ICs
• Receipt and Storage of ICs
• Assembling PC Boards
• Testing PC Boards

• Chapter 4: Through-Hole Mounting Methods (24 KB)

• Soldering by Dipping or Solder Wave
• Repairing Soldered Joints

• Chapter 5: SMD Mounting Methods (2,073 KB)

• Introduction
• Double-Wave Soldering
• Reflow Soldering
• Replacing a Soldered IC
• Assessment of Soldered Joint Quality
• SMD Footprints
• SO Footprint (Reflow Soldering)
• SO Footprint (Wave Soldering)
• SSOP, VSO, & TSSOP Footprint (Reflow Soldering)
• SSOP, VSO, & TSSOP Footprint (Wave Soldering
• QFP, SQFP, LQFP, & TQFP (Reflow Soldering)
• QFP, SQFP, LQFP, & TQFP (Wave Soldering)
• PLCC Footprint (Reflow Soldering)
• PLCC Footprint (Wave Soldering)

• Chapter 6: Thermal Design Considerations (371 KB)

• Introduction
• Thermal Resistance
• Junction Temperature
• Factors Affecting R_th(j-a)
• Thermal Resistance Test Methods
• Test Procedure
• Forced Air Factors for Thermal Resistance
• Thermal Resistance Data - Assumptions and Precautions
• Thermal Resistance (R_th(j-a)) Data
• Thermal Resistance (R_th(j-a)) Data Tables - Power Packages

• Chapter 7: Packing Methods (2,027 KB)

• Introduction
• Glossary of Terms
• Drypack for Moisture Sensitive SMDs
• Survey of IC Packing Methods
• Packing Methods in Exploded View
• Packing Quantities, Box Dimensions and Carrier Shapes

• Chapter 8: Environmental Data on ICs (811 KB)

• Introduction
• Explanation of the Tables
• Substances Not Used by Philips Semiconductors
• Disposal
• Recycling
• General Warnings
  Note: For current package Chemical Content, please see the relevant Product Information Page.
  • Plastic Ball Grid Array Packages
  • Low Profile Fine Pitch Ball Grid Array Package
  • Dual In-Line Packages
  • Shrink Dual In-Line Packages
  • Small Outline Packages
  • Shrink Small Outline Packages
  • Thin Shrink Small Outline Packages
  • Plastic Leaded Carrier Packages
  • Quad Flat Packages
  • Low Profile Quad Flat Packages
  • Through Hole Power Packages
  • Through Hole Medium Power Packages
  • Heatslug Small Outline Packages
  • Thin Quad Flat Packages

• Chapter 9: Data Handbook System (94 KB)

• Other Philips Semiconductors and Philips Components Data Handbook Titles

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